Smart 3D Inspection for Semiconductor

After laser dicing and/or scribing is complete, Gocator® 3D Line Confocal Sensors are used to measure the accuracy of the groove placement, groove depth, and kerf width of the wafer scribing to prevent defects such as die chipping. This allows for more usable die per wafer, and ensures maximum quality and processing speeds for the highest production throughput.

Wafer Inspection (Dimensioning, Sorting, Defect Detection)

Gocator® 3D Line Confocal Sensors are used to scan and inspect wafer size, thickness, and flatness, in addition to providing high-precision defect detection of die chips and other surface imperfections.

Wafer Sorting

Gocator® line confocal sensors generate 3D topography (for 3D surface geometry), 3D tomography (for multi-layer 3D geometry), and 2D intensity data simultaneously, allowing these sensors to handle virtually any material type including multi-layered, transparent, curved, mixed material, and more.

Generates Three Data Types

Gocator® 5500

LEARN MORE

The industry’s first smart 3D line confocal sensors

Fast Scan Rates

5500 LP icons presentation High Speed Scanning

Gocator® 5500 sensors feature a custom high-speed imager and high-performance electronics to deliver metrology-grade inspection at over 10 kHz with PC acceleration.

1250x500 Semiconductor SiliconWaferInspection

Gocator 3D line confocal sensors are used for inspection of BGA and PGA position, height, and radius during assembly and test IC.

BGA/PGA Inspection (Position, Height, Radius)

Gocator® 3D Line Confocal Sensors can accurately inspect the height and position of the PGA pins to ensure that there are no poor contacts created during the subsequent insertion and removal process, and to prevent defects such as pin damage caused by positional errors.

PGA (Pin Grid Array) Inspection

Gocator® 3D Line Confocal Sensors can accurately measure ball height, ball position, and other dimensional information of the ball with a diameter of less than 50µm.

BGA (Ball Grid Array) Inspection

Gocator® 5500 Series

LEARN MORE

The industry’s first smart 3D line confocal sensors

Gocator® 3D Line Confocal Sensors can accurately measure and inspect the flatness and height of joint position before welding, and minimize the breakage of each solder joint after subsequent welding is completed.

Solder Joint Inspection

Onboard tools allow users to take area and volume measurements without having to invest in 3rd party vision software or develop custom tool sets on their own.

Built-in Measurement Tools

Gocator® 3D Line Confocal Sensors are used to accurately measure the surface area of coated silver epoxy in each lead frame area, as well as the height (i.e. thickness) of the epoxy glue bead.

Silver Epoxy Inspection (Dye Process)

FocalSpec LP Icons Wide Variety of Challenging Materials

3D imaging is contrast-invariant and can therefore be used to scan a range of adhesive material types from opaque to translucent and transparent. In comparison, 2D solutions cannot provide shape measurements because they only generate contrast-based data.

Scans Any Material Type

Gocator sensors generate the essential 3D shape data required for precision volumetric measurement and shape-based defect detection (e.g. bubbles, thickness) on the glue bead.

3D Shape Data

LEARN MORE

Gocator® 5500 series

The industry’s first smart 3D line confocal sensors

Gocator® 3D Line Confocal Sensors are used for high accuracy measurement of the arch-height and position of the wire (gold, copper, or aluminum).

Wire Bonding Defect Detection

Features such as the web-browser driven point-and-click environment for rapid configuration, built-in measurement tools and rich I/O for communicating results make it easy for factory technicians to get the results they need.

Web-Based User Interface

High Performance on Challenging Surfaces

Gocator line confocal sensors provide excellent performance on highly reflective, mirror-like, transparent, and multilayered surfaces.

Gocator line confocal sensors also detect defects in the wire itself, such as breaks or bends.

Defect Detection

The industry’s first smart 3D line confocal sensors

LEARN MORE

Gocator® 5500 series

1250x500 Semiconductor WireBondInspection

Gocator® 3D Line Confocal Sensors accurately capture the diameter and height (thickness) of the ball down to 2.5 microns.

Ball-Bumping Dimensional Measurement

Gocator® line confocal sensors generate up to 28 million 3D and 2D data points per second per surface.

High-Density Data Generation

Coplanarity Measurement

Gocator line confocal sensors are also used to inspect the coplanarity between all ball bumps––detecting any height variation that can cause uneven distribution of force, die fractures, and open circuits.

The industry’s first smart 3D line confocal sensors

LEARN MORE

Gocator® 5500

5500 LP icons High Resolution Imaging new

Gocator line confocal sensors achieve X resolutions up to to 2.1 µm (X) and Z-repeatability up to 0.05 µm for highly precise and accurate measurements.

High Resolution and Repeatability

1250x500 Semiconductor BallBumpDimensioning

Final Packaging Measurement and Inspection

Gocator® 3D Line Confocal Sensors can capture the length, width, and height of the chip after final packaging.

FactorySmartAI Icons Superhuman Performance

Gocator 3D smart sensors connect seamlessly with networks to communicate results, display diagnostics and statistics over web browsers, access upgrades over the Internet, and interface with factory equipment.

FactorySmart® Sensors

2D Intensity Output

These sensors can also output high-resolution 2D grayscale images to detect defects such as pits and scratches.

The industry’s first smart 3D line confocal sensors

LEARN MORE

Gocator® 5500 series

1250x500 Semiconductor FinalPackageInspection

3D Smart Sensors for Semiconductor Manufacturing Inspection

Semiconductor fabrication is a multi-step manufacturing sequence made up of mechanical, photolithographic, and chemical processing steps, during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are chosen for specialized applications.

Gocator® 3D Line Confocal Sensors deliver precision inline 3D scanning and inspection at various stages of this fabrication process for maximum product quality and optimal production throughput.

5500 Series

Contact Sales

LMI Technologies designs and delivers cutting-edge smart 3D technologies for the factory. Trusted in industries from automotive and consumer electronics to rubber & tire, road & rail, and wood, our 3D solutions improve production through inspection, automation, and optimization of your products and processes.

Complete the form to be contacted by an expert sales representative who will guide you toward a robust 3D solution.

3D Smart Sensors for Semiconductor Manufacturing Inspection

Recommended Solution

Recommended Solution

Contact Sales